New thermal and rheological approaches of chickpea-wheat dough for breadmaking

BIGNE F.; ROMERO A; FERRERO C.; PUPPO M.C.; GUERRERO A.

EUROPEAN FOOD RESEARCH AND TECHNOLOGY

SPRINGER

Año: 2021 vol. 247 p. 1107 - 1115

1438-2377

Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich inproteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds withantioxidant activity. Therefore, chickpea flour can be an attractive high nutritionalcomplement to wheat flour for the formulation of composite breads. In the presentstudy, the thermal and rheological characteristics of the chickpea-wheat doughobtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour wereassessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA),Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA).Higher gelatinization temperatures in coincidence with higher pasting temperatureswith lower breakdown and setback of the pastes were obtained for the chickpea-wheatmixtures. Furthermore, the viscoelasticity of the wheat dough changed with thepresence of chickpea flour, leading to higher dynamic moduli (E?, E??) and lower valuesof tangent of the phase angle (tan δ=E??/E?) suggesting the formation of a more elasticmatrix. At higher deformations (TPA), higher values of hardness and elasticity wereobserved. These changes were associated with a marked disruption of the glutennetwork by the presence of certain chickpea components like proteins, assessed bydifferent microscopic techniques.