DENDRITE SPACING IN Al-Cu AND Al-Si-Cu ALLOYS AS FUNCTION OF THE GROWTH PARAMETERS

A. E. ARES; C.T. RIOS; R. CARAM; C. E. SCHVEZOV

Seattle, Washington. USA.

Simposio; LIGHT METALS 2002; 2002

The Minerals, Metals and Materials Society.

Aluminum alloys containing Copper and Silicon were directionally solidified in a range of velocities and thermal gradients producing dendritic structures. The primary and secondary spacings were measured and correlated with the main solidification parameters. The results were also compared with the main theoretical models from the literature. The results are presented and discussed in the frame of the models available. As a main conclusion of the present investigation the results agree with the general observations reported in the literature that an increase in the growth velocity produce a decrease in the primary spacing, and an increase in the local solidification time produce an increase in the secondary spacing.