SOMMADOSSI silvana Andrea
The characterisation of diffusion soldered Cu/In/Cu interconnections is presented in this work. The main feature of
S. SOMMADOSSI, W. GUST AND E. J. MITTEMEIJER
MATERIALS SCIENCE AND TECHNOLOGY
Año: 2003 vol. 19 p. 528 - 534
The characterisation of diffusion soldered Cu/In/Cu interconnections is presented in this work. The main feature of this joining process is the production of a bond at a low fabrication temperature, which allows high service temperatures. The interconnection is formed entirely by intermetallic phases (IPs) which form isothermally first by a liquid solid reaction and then by a solid solid reaction. The morphology and the growth kinetics of the IPs formed in the interconnection zone at temperatures in the range 180 430°C were examined by electron probe microanalysis, X-ray diffraction and transmission electron diffraction analysis. In accordance with the phase diagram, the phases Cu11In9, Cu2In and Cu7In3 (at T<310°C) and Cu2In and Cu7In3 (at T>310°C) appeared in the interconnection zone. The thickness of the IPs formed during the solid solid reaction obeyed a parabolic growth law. The growth rate constants were calculated for the Cu2In and Cu7In3 phases. Using these values and the equilibrium concentration of the IPs, the integral interdiffusion coefficients were calculated through Wagners approach.