Fabrication of silicon microarray by laser micromachining and wet etching

B. LERNER; M.S. PEREZ; C. TORO; C. LASORSA; M.J. DIEGUEZ; F. SACCO; J.A. LELL; B. CETRALONGO; C.A. RINALDI; A.LAMAGNA.

Nuremberg

Congreso; IMCS 2012 - The 14th International Meeting on Chemical Sensors; 2012

Experiments on laser ablation with silicon (Si) wafers have been performed using silicon nitride (Si3N4) as a sacrificial layer to find the optimal fluence capable of removing the Si3N4, which allows the subsequent anisotropic etching in Si with potassium hydroxide. As a result, an alternative to the traditional micromachining techniquesthat require more steps and processing times has been introduced. The effect of the pulse numbers on Si wafers has been studied and it has been observed that when increasing the pulse numbers at the same fluence, the capacity of the pyramidal cavity formed was greater than using only one pulse at higher fluences. This happens to be very useful for the development of drug delivery systems and microarrays.