An alternative method for the manufacture of micropores by using the combination of laser ablation and wet etching.

M.S. PEREZ; B. LERNER; C. TORO; C. LASORSA; J.A. LELL; A. FASCISZ ZEBALLOS; B. CETRALONGO; E.M. SALMORAL; C.A. RINALDI; A. LAMAGNA

Congreso; IMCS 2012,14th International Meeting on Chemical Sensors; 2012

The work presents an alternative method for the manufacture of micropores by using the combination of laser ablation and wet etching. The process of laser ablation was done on silicon (Si) wafers with silicon nitride (Si3N4) used as a sacrificial layer. The size of the pores was carefully controlled by following an optical technique. The method exhibits a series of advantages in relation micromachining techniques previously used.