Thermal Characterization of Lead-Free SnAgCu Solder Alloys

MORANDO CARINA; GARBELLINI OLGA; FORNARO OSVALDO; PALACIO HUGO A

Pittsburg

Congreso; Materials Science &Technology Conference and Exhibition; 2012

The Minerals, Materials Science

Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherenttoxicity of Pb. This situation drives to replace the eutectic Sn-Pb solder used commonly as joining material to suitable Lead Free Solders (LFS) for microelectronic assembly. Alloy belong to Sn-Ag-Cu system (SAC Alloys) are potential LFS. However, still results very difficult to establish reliable data about thermal properties which are fundamental to interpret the solidification process and fluidity properties of alloys belonging to this system obtained in preliminary works. In this work, an analysis of the solidification process of binary Sn-Ag, Sn-Cu and ternary Sn-Ag-Cu were carried out by using Computer Aided Cooling Curve Analysis (CA-CCA) and Differential Scanning Calorimetry (DSC).