Molecular Dynamics Simulation of Interaction between Shock Wave and High‐Symmetry Intergranular Boundary

V.V. DREMOV; PH.A. SAPHOZHNIKOV; E.M. BRINGA

Baltimore, Maryland

Congreso; SHOCK COMPRESSION OF CONDENSED MATTER - 2005; 2005

American Institute of Physics

The paper presents results of the molecular dynamics simulation on the interaction of a shock wave with a highly‐symmetric grain boundary in copper. Our calculations were done for five slopes of the boundary (110) Σ5 to the shock front and for two levels of loading: above the Hugoniot elastic limit but below the critical level at which the homogeneous dislocation production occurs and above that critical level. Shock‐induced defects and their role in shear stress relaxation have been analyzed. It has been shown that there are two competing shear stress relaxation mechanisms as a result of the grain boundary shock interaction. Calculations of the temperature evolution in the vicinity of the grain boundary make evidence for the possibility of local melting far below the intersection of the Hugoniot and the melting line. © 2006 American Institute of Physics