Novel architecture for high-performance solid-oxide fuel cell cathodes based on cobaltite nanotubes

MARTÍN BELLINO,; JOAQUIN SACANELL; DIEGO LAMAS,; GABRIELA LEYVA, ANA; WALSÖE DE RECA, NOEMI

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

American Chemical Society

Lugar: Washington DC; Año: 2007 vol. 129 p. 3066 - 3067

0002-7863

Fuel cells are one of the most promising devices for environmentally clean power generation by converting chemical energy directly into electrical energy.1 Among them, solid-oxide fuel cells (SOFCs) have the advantage of allowing the use of different fuels such as hydrogen or hydrocarbons. Significant effort has been devoted to lower the operation temperature of these devices giving rise to the intermediate temperature SOFCs (IT-SOFCs) which operate at 500-700 °C, avoiding degradation problems due to thermal cycling or diffusion at interfaces and reducing the cost of the interconnection materials. thermal cycling or diffusion at interfaces and reducing the cost of the interconnection materials. (SOFCs) have the advantage of allowing the use of different fuels such as hydrogen or hydrocarbons. Significant effort has been devoted to lower the operation temperature of these devices giving rise to the intermediate temperature SOFCs (IT-SOFCs) which operate at 500-700 °C, avoiding degradation problems due to thermal cycling or diffusion at interfaces and reducing the cost of the interconnection materials. thermal cycling or diffusion at interfaces and reducing the cost of the interconnection materials. 1 Among them, solid-oxide fuel cells (SOFCs) have the advantage of allowing the use of different fuels such as hydrogen or hydrocarbons. Significant effort has been devoted to lower the operation temperature of these devices giving rise to the intermediate temperature SOFCs (IT-SOFCs) which operate at 500-700 °C, avoiding degradation problems due to thermal cycling or diffusion at interfaces and reducing the cost of the interconnection materials. thermal cycling or diffusion at interfaces and reducing the cost of the interconnection materials. -700 °C, avoiding degradation problems due to thermal cycling or diffusion at interfaces and reducing the cost of the interconnection materials.