Kinetic behavior in diffusion soldered Ni/Al/Ni interconnections

G.A., SOMMADOSSI S., ZIEBA P., GUST W., MITTEMEIJER E.J.

MATERIALS CHEMISTRY AND PHYSICS

Año: 2002 vol. 78 p. 459 - 463

0254-0584

The layer growth of intermetallic phases occurring in Ni/Al/Ni interconnections formed by the process of diffusion solderingwas studied. The layer thicknesses as a function of the treatment time at 720 .C and the Ni concentration profiles in the interconnection zone were measured for the stoichiometric AlNi, Ni-rich AlNi, and AlNi3 compounds. The growth rate constants were calculated, considering the incubation and transition periods preceding the steady-state growth of the intermetallic phases. The fastest growth occurs for stoichiometric AlNi and the slowest growth occurs for Ni-rich AlNi. The values of the integral interdiffusion coefficients for the stoichiometric AlNi, Ni-rich AlNi, and AlNi3 were determined. The results fall within the range of values presented in previouswork dedicated to Ni/Al diffusion couples..C and the Ni concentration profiles in the interconnection zone were measured for the stoichiometric AlNi, Ni-rich AlNi, and AlNi3 compounds. The growth rate constants were calculated, considering the incubation and transition periods preceding the steady-state growth of the intermetallic phases. The fastest growth occurs for stoichiometric AlNi and the slowest growth occurs for Ni-rich AlNi. The values of the integral interdiffusion coefficients for the stoichiometric AlNi, Ni-rich AlNi, and AlNi3 were determined. The results fall within the range of values presented in previouswork dedicated to Ni/Al diffusion couples.3 compounds. The growth rate constants were calculated, considering the incubation and transition periods preceding the steady-state growth of the intermetallic phases. The fastest growth occurs for stoichiometric AlNi and the slowest growth occurs for Ni-rich AlNi. The values of the integral interdiffusion coefficients for the stoichiometric AlNi, Ni-rich AlNi, and AlNi3 were determined. The results fall within the range of values presented in previouswork dedicated to Ni/Al diffusion couples.3 were determined. The results fall within the range of values presented in previouswork dedicated to Ni/Al diffusion couples.