In situ evaluation of the interfacial crack evolution in 3 Ag-BSCCO tapes subjected to three-point bending

M. T. MALACHEVSKY; C.D'OVIDIO; D.A. ESPARZA

PHYSICA C - SUPERCONDUTIVITY

ELSEVIER SCIENCE BV

Lugar: Amsterdam; Año: 2002 vol. 372 p. 935 - 938

0921-4534

When a one-filament Ag-BSCCO tape is subjected to bending, the ceramic in contact with the metal sheath of the outer face would suffer the maximum tension loads.Crack formation will start at this point, leading to a decrease in the critical current density Jc. The study of the crack evolution of the ceramic at the interface can be used as a factor of merit for the composite performance.After chemically removing a square-shaped area of the silver sheath, we subjected the samples to in situ three-point bending inside a SEM chamber, directly following the microstructural changes produced by the formation and propagation of cracks.The influence of the intermediate deformation procedures employed for the tape fabrication on the mechanical and transport properties was also investigated.