Thermal diode assisted by geometry under cycling temperature

L. ZURDO; L. CHEJ; A. MONASTRA; M. F. CARUSELA

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

PERGAMON-ELSEVIER SCIENCE LTD

Lugar: Amsterdam; Año: 2024

0017-9310

Technological progress in electronics enabled their use in increasingly aggressive environments, suchas rapid thermal cycling and high power density. Improved techniques to thermally protect criticalelectronic components are vital to ensure their durability and reliability. We model the heat transportacross a square plate with a hole subjected to an oscillating external temperature, such spatial andtemporal symmetries are broken. We find rectification of the heat current that strongly depends on thefrequency and the geometry of the hole. This system could be used as part of a thermal architecture,to dissipate heat under cycling temperature conditions