PROBIEN   20416
INSTITUTO DE INVESTIGACION Y DESARROLLO EN INGENIERIA DE PROCESOS, BIOTECNOLOGIA Y ENERGIAS ALTERNATIVAS
Unidad Ejecutora - UE
artículos
Título:
Diffusion soldering using a Gallium metallic paste as solder
Autor/es:
S. SOMMADOSSI, H. E. TROIANI, A. FERNÁNDEZ GUILLERMET
Revista:
JOURNAL OF MATERIALS SCIENCE
Referencias:
Año: 2007 vol. 42 p. 9707 - 9712
ISSN:
0022-2461
Resumen:
n this work preliminary results are reported on the characterization of Pbfree
joints produced by using a diffusion soldering method at a process
temperature of 700 ?C during 20 min. The solder alloy is a metallic paste
involving Ga and Al and Ni powder, and the substrates are Cu and Ni. The
dissolution and diffusion-reaction processes, which take place at the interfaces
of the interconnection zone, have been investigated by means of SEM and
EPMA. A solid solution and intermetallic compounds (IMCs) with high melting
2
point form as layers almost free from defect, allowing service temperatures
about 500?C higher than the process temperature. The phase stability
sequence starting from the Ni to the Cu interface is the following: ¿?L-Ni3Ga,¿?L-Ni3Ga,
ÁCu9Ga4, À-Cu3Ga and (Cu) solid solution of the Ga-Cu system. The relative
reaction front displacement of the layers and the implications of the present
findings for the applicability of the diffusion-soldering method are also
discussed.
reaction front displacement of the layers and the implications of the present
findings for the applicability of the diffusion-soldering method are also
discussed.
reaction front displacement of the layers and the implications of the present
findings for the applicability of the diffusion-soldering method are also
discussed.
Cu9Ga4, À-Cu3Ga and (Cu) solid solution of the Ga-Cu system. The relative
reaction front displacement of the layers and the implications of the present
findings for the applicability of the diffusion-soldering method are also
discussed.