Towards Phase Nanoseparation in Epoxy Systems Containing PEO/PPO/PEO Block Copolymers by Controlling Cure Conditions and Molar Ratios between Blocks. Part 1. Cure Kinetics

LARRAÑAGA, M.; MARTIN D.; GABILONDO N.; KORTABERRIA G.; ECEIZA A.; RICCARDI C.C.; MONDRAGON I.

COLLOID AND POLYMER SCIENCE

Año: 2006 vol. 284 p. 1403 - 1410

0303-402X

Nanostructuring of thermosetting systems using the concept of templating and taking advantage of the self-assembling capability of block copolymers is an exciting way for designing new materials for nanotechnological applications. In this first part of the work, reactive blends based on stoichiometric amounts of a diglycidylether of bisphenol-A epoxy resin and 4,4?Œ-diaminodiphenylmethane cure agent modified with three poly(ethylene oxide)-co-poly (propylene oxide)-co-poly(ethylene oxide) block copolymers were studied. Cure advancement of these systems was analyzed by differential scanning calorimetry. The experimental results show a delay of cure rate, which increases as copolymer content and PEO molar ratio in the block copolymer rise. Infrared spectroscopy shows that PEO block is mainly responsible of physical interactions between the hydroxyl groups of growing epoxy thermoset and ether bonds of block copolymer. These interactions are mainly responsible forthe delaying of cure kinetics. The molar ratio between blocks also has a critical influence on the delaying of the cure rate. A mechanistic approach of cure kinetics allows us to relate the delay of cure as a consequence of block copolymer adding to physical interactions between components.?Œ-diaminodiphenylmethane cure agent modified with three poly(ethylene oxide)-co-poly (propylene oxide)-co-poly(ethylene oxide) block copolymers were studied. Cure advancement of these systems was analyzed by differential scanning calorimetry. The experimental results show a delay of cure rate, which increases as copolymer content and PEO molar ratio in the block copolymer rise. Infrared spectroscopy shows that PEO block is mainly responsible of physical interactions between the hydroxyl groups of growing epoxy thermoset and ether bonds of block copolymer. These interactions are mainly responsible forthe delaying of cure kinetics. The molar ratio between blocks also has a critical influence on the delaying of the cure rate. A mechanistic approach of cure kinetics allows us to relate the delay of cure as a consequence of block copolymer adding to physical interactions between components.