Characterization of an Al/Al-5wt %Cu bond casted via a double-pouring approach

GUO WU; M GALANO; KEYNA O REILLY

Conferencia; National Student Conference in Metallic Materials; 2012

The bonding of aluminium alloys has always been difficult because of the rapidly developed oxide layers on the surfaces. The oxide layers serve as diffusion barriers and metallic bonding is achieved only when the oxide layers have been dissolved or disrupted between two metals. The present study is to investigate the feasibility of using casting approaches to the bonding of aluminium alloys, as the casting of one alloy onto or around the other alloy allows more flexibility in the shape of final products. In this poster, a novel double-pouring approach for bonding of Al and Al-5wt % Cu has been proposed and the evolution of bond interface and oxide layers during casting has been studied by SEM and EDX. The results indicate that a well-bonded interface between Al and Al-Cu has been achieved, along with double oxide film defects distributing at the bond interface discontinuously.