Surface characterization of self-assembled N-Cu nanostructures

LUCILA CRISTINA; J. C. MORENO-LÓPEZ; S. SFERCO; M. C. G. PASSEGGI(JR); R.A. VIDAL; J. FERRÓN

Beijing

Congreso; 18th International Vacuum Congress (IVC-18); 2010

Chinese Vacuum Society (CVS)

We report on the process of low energy N2+ implantation and annealing fo a Cu(001) surface. Through AES we study the N diffusion features as a function of the substrate temperature. With STM and LEIS we characterize the surface morphology and the electronic structure is analyzed with ARUPS. Under annealing (500 K<T<700 K) N migrates to the surface and reacts forming a CuxN compound that decomposes at temperatures above 700 K.LEIS measurements show that N locates on the four-fold hollow sites of the Cu(001) surface in a c(2x2) arrangement. Finally, gaps along different azimuthal directions are determined by ARUPS. DFT calculations provide support to our conclusions.