INVESTIGADORES
VALCARCE Maria beatriz
artículos
Título:
Copper Recovery from Printed Circuit Boards Using Acidic Ferric Chloride Leaching and Electrodeposition
Autor/es:
F. MASARI; S. CERÉ; M.B. VALCARCE
Revista:
JOM (1989)
Editorial:
SPRINGER
Referencias:
Año: 2020
ISSN:
1047-4838
Resumen:
In this work, 0.5 mol L1 HCl and 0.13 mol L1 FeCl3 have been used asleaching solution of industrially wasted copper at room temperature. Copperrecovery from the leaching solution has been studied by batch electrodepositionat room temperature and either by using different constant currentdensities or by pulsing the current. The deposits obtained at 20 mA cm2 showlow efficiencies and are mainly composed of Cu0 with CuCl being a minorcomponent. When the deposits are obtained at 50 mA cm2, the efficiency ishigher, but the adherence is poor and the porosity is high. By using pulsedelectrodeposition, it is possible to improve the adherence of the deposits.However, the deposits are contaminated with copper and iron oxides, as wellas with chloride compounds. Tin was not detected in any of the deposits obtainedusing all the electrodeposition conditions tested in this work.
