T9 Culturing cells in microchannels for monoclonal antibodies production

PEÑAHERRERA A; PAYÉS C; BOURGUIGNON N; KARP P; LASORSA C; ROSERO G; ATTALLAH C; GRANELL P; GOLMAR F; LERNER B; HELGUERA G; PÉREZ M

LA PLATA

Congreso; XIV Reunión sobre Avances en Física de Fluidos y sus Aplicaciones; 2016

Centro Científico Tecnológico (CCT) La Plata - CONICET

Monoclonal antibodies production for therapeutic use is a growing industrial area. Production inmixed reactors faces challenges related with the quality of product, glycosylation control and reproducibility.One approach to improve the control is to reduce the scale of the production platform through microdevices[1]. Anti-FN-a2b is a chimeric molecule as it has scFv region from a murine model and the Fc region from ahuman origin[2]. These recombinant antibodies show neutralizing ability of antiviral and antiproliferativeactivity of IGN-a2b, in vitro. Some autoinmmune diseases like systemic erythematosus lupus progresseswith high levels of IFN-a, aecting the life quality of patients. In this study, two types of cells that produce the antibody, HEK-293 and CHO-K1 were cultured in poly-dimetil silaxane (PDMS) microdevices bondedto glass. Microchannels were covered with poly-lysine to attach cells to microchannels and dierentgeometries have been tested, narrow and wide microchannels. Cell covered area was measured and itwas determine that wide channels presented higher cell growth[3] . Furthermore, cell distribution wasevaluated through Vesicle stomatitis virus (VSV) infection and subsequent Green Fluorescent Protein(GFP) expression.[1] Garza-Garca, et al. 2013, A biopharmaceutical plant on a chip: continuous microdevices forproduction of monoclonal antibodies. Lab on a Chip, Vol.13, (7): 1243-1247.[2] Zeitlin et al. 2016, Monoclonal antibody therapy for Junin virus infection. Proceedings of theNational Academy of Science Vol. 113(16):4458-63[3] Pe~naherrera et al. 2016 Evaluation of cell culture in microuidic chips for application in monoclonalantibody production. Microelectronic Engineering Vol. 158, (1): 126-129.