Rupture of liquid Cu films on SiO2 substrates

A. G. GONZÁLEZ; J. A. DIEZ; Y. WU; J. D. FOWLKES; P. D. RACK; L. KONDIC

Mar del Plata

Encuentro; XIII Encuentro Nacional de Superficies y Materiales Nanoestructurados; 2013

Fundación Argentina de Nanotecnología

p { margin-bottom: 0.21cm; direction: ltr; color: rgb(0, 0, 0); line-height: 115%; widows: 2; orphans: 2; }p.western { font-family: "Calibri",sans-serif; font-size: 11pt; }p.cjk { font-family: "Calibri",sans-serif; font-size: 11pt; }p.ctl { font-family: "Times New Roman",serif; font-size: 11pt; }a:link { color: rgb(0, 0, 255); } We study the instability of nanometric Cu thin films on a SiO2 substrate. The metal is melted by means of laser pulses for some tens of nanoseconds. The free surface destabilizes during the liquid lifetime, leading to the formation of holes at first and to metal drops on the substrate in later stages. By analyzing the Fourier transforms of the SEM images obtained during the metal film evolution, we determine the emerging length scales for both early and late stages of the instability development.