UNIDEF 23986
UNIDAD DE INVESTIGACION Y DESARROLLO ESTRATEGICO PARA LA DEFENSA
Unidad Ejecutora - UE
artículos
Título:
A Novel Approach for Simple, Fast and Cheap Packaging of MEMS and MMIC
Autor/es:
JULIO LONAC; CARLOS LONGO; GUSTAVO ARIEL MERLETTI; DANIEL GASULLA; CRISTIAN ARRIETA; JUAN JOSÉ ORTÍZ; D. DAVID DE LIMA
Revista:
sensors & transducers
Editorial:
IFSA Publishing: Barcelona Toronto
Referencias:
Año: 2018 vol. 228 p. 63 - 70
ISSN:
1726-5479
Resumen:
The packaging of MEMS and MMIC devices has become a trending topic in the last years. This paperpresents a novel approach for MEMS and MMIC packaging. The proposed packaging procedure combines simplesingle layer printed circuit board (PCB) techniques, Wire-Bonding and 3D printing, resulting in a simple, fast andcheap alternative. Since there is no need for Via Holes the package performance is privileged while the fabricationprocess is simplified. The novel approach was used in the design and fabrication of a package for a RF MEMSdigital phase shifter. The simulation and measurements data are presented alongside with the related conclusions.
