Formation of Cu and Ni nanowires by electrodeposition

L.A. MEIER; A.E. ALVAREZ; S.G. GARCÍA; M.C. DEL BARRIO

Procedia Materials Science

ELSEVIER SCIENCE

Lugar: Ámsterdam; Año: 2015 vol. 8 p. 617 - 622

2211-8128

In this work we analyzed the formation of Cu and Ni nanowires by electrodeposition inside alumina templates. The deposits were performed from CuSO4 + H2SO4 and NiSO4 + NiCl2 + H3BO3 + H2SO4 solutions for the electrodeposition of Cu and Ni, respectively. To allow the cations deposition, sufficiently negative potentials were used. The experience time was ranged between 500s and 1h. After the metal electrodeposition, the sample was immersed in NaOH to dissolve the alumina membrane and to expose the generated deposit. The obtained nanostructures were characterized by SEM (scanning electron microscopy) and EDX (energy dispersive microanalysis X-ray). Deposits were corresponded with nanowires having an average diameter of 300 nm. The length of the nanostructures was about 10 microns. EDX analysis confirmed the nature of deposits.