Reduction of Cu (II) to Cu (I) in the solid CuCsCl3

BAZÁN, JULIO CÉSAR; LESCANO, GABRIELA MARIEL; PRAT, MARÍA ROSA; SAGUA, AURORA

MATERIALS CHEMISTRY AND PHYSICS

ELSEVIER SCIENCE SA

Año: 2011 vol. 125 p. 542 - 547

0254-0584

The solid state reaction Cu + Cu2+ ___ 2Cu+ in CsCuCl3 was studied at 499 K using a cell in which the Cu(II) sample was put between two copper discs. Mass changes, thickness of the product layer and the total electrical resistance of the cell were measured as a function of time, both with and without (spontaneous) applied voltage. Applied voltage had an asymmetrical effect: it increased the rate at the anodic side, with no change at the cathodic one. The process was found to be under diffusive control, following a parabolic relationship with time. It was interpreted in terms of the movements of Cu(I) ions and electron holes