Fully functional fine-grain vertically integrated 3D focal plane neuromorphic processor

M. DI FEDERICO; P. JULIAN; A. G. ANDREOU; P. MANDOLESI

Millbrae, California

Congreso; SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE; 2014

This paper presents the first fully functional fine-grain 3D vertically integrated focal plane system processor, implemented in the 3D interconnection technology of Tezzaron Semiconductors. The processor consists of an array of cells, auxiliar structures and general purpose blocks. The chip can acquire video and apply a series of image processing tasks to each frame employing local computation among cells. The chip has been successfully tested at 50Mhz.