Soy Protein Isolate (SPI) electrospun mats using benign solvent

G.A. ABRAHAM; M. POPOV

Mar del Plata

Simposio; XVI Simposio Latinoamericano de Polímeros SLAP2018; 2018

INTEMA

Tailorable biodegradability, abundance, relatively low cost, long storage stability, low immunogenicity, and structural similarity to the extracellular matrix components, are some of soy protein?s interesting properties that makes it attractive to the biomaterials field. Therefore, it has been proposed for several biomedical applications, such as wound dressing, tissue engineering and drug delivery systems, among others. Therefore, the aim of this work was to obtain electrospun scaffolds based on soy protein isolate (SPI), commercially available form of soy protein that contains more than 90% of proteins, using polyethylene oxide (PEO) as carrier polymer.Moreover, following recent researches, this work also aims the use of benign solvent (e.g. acetic acid, formic acid, and acetone) to avoid possible harmful and/or residues in the samples, which would reduce the material application in the biomaterials field.